Career thickness measuring instrument (CME-06 type: semi-automatic type)
This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and double-sided polishing process.
Set the carrier, move to the pre-set measurement position by operating the [Start] switch, and perform the measurement by operating the [Measure] switch. The θ-axis direction depends on the operator's setting. The measurement values will be displayed on the counter. It is also possible to record the data on a computer as an option.
- Company：ジャステム
- Price：Other
